Kwitekhnoloji ehlala iguquka yetekhnoloji yokubonisa, iziboniso zekristale zolwelo (i-LCDs) zime njengabalindi abafumaneka kuyo yonke indawo, zikhanyisela yonke into ukusuka kwizixhobo eziphathwa ngesandla ukuya kwiimpawu zedijithali. Ngaphakathi kobu bume bomhlaba ohlukeneyo, indlela ethile yokwenza izinto, eyaziwa ngokuba yiChip-on-Board (COB), ibambe isikhundla esibalulekileyo, nangona sisoloko sijongelwa phantsi, ukubaluleka. Kwi-Malio Technology, sihlala sizama ukucacisa ubuchwephesha bobuchwephesha bokuboniswa, sixhobisa abathengi bethu ukuqonda okunzulu kwamacandelo axhasa ukuvela kwabo. Lo mboniso ugocagoca kwimiba ephambili ye-COB LCDs, iphonononga uyilo, iingenelo, kunye nomahluko kwiitekhnoloji ezinxulumeneyo.
Kwisiseko sayo esisisiseko, i-COB LCD iphawulwa ngokuncamathela ngokuthe ngqo kweetshiphusi zesekethe enye okanye ngaphezulu ezidityanisiweyo (IC) - ngokuqhelekileyo umqhubi obonisayo - kwi-substrate yeglasi yephaneli yeLCD. Oku kudityaniswa ngokuthe ngqo kuphunyezwa ngenkqubo eyaziwa ngokuba yi-wire bonding, apho i-minuscule yegolide okanye iingcingo ze-aluminiyam ziqhagamshela ngokucokisekileyo iipads kwi-silicon die kwiipads conductive ezihambelanayo kwiglasi. Emva koko, i-encapsulant ekhuselayo, ehlala i-epoxy resin, isetyenziselwa ukukhusela i-chip ethambileyo kunye neebhondi zocingo kwiingcinezelo zendalo ezifana nokufuma kunye nefuthe lomzimba. Oku kudityaniswa komqhubi wesekethe ngokuthe ngqo kwiglasi kuvelisa imodyuli edityanisiweyo neyomeleleyo xa kuthelekiswa nobunye ubuchule bokuhlanganisa.
Iimpembelelo zale paradigm yoyilo zininzi. Olona ncedo lubalulekileyo lwetekhnoloji yeCOB kukusebenza kwayo kwendawo. Ngokuphelisa imfuno yebhodi yesekethe eprintiweyo eyahlukileyo (PCB) yokubeka ii-ICs zomqhubi, iimodyuli zeCOB zibonisa unyawo oluncitshisiweyo kakhulu. Oku kuhambelana kubaluleke kakhulu kwizicelo apho isithuba siphezulu, esifana nobuchwepheshe obunxitywayo, izixhobo eziphathwa ngesandla, kunye neziboniso ezithile zeemoto. Ngaphaya koko, iindlela ezimfutshane zombane phakathi kwetshiphu yomqhubi kunye nephaneli yeLCD inegalelo ekuphuculeni imfezeko yomqondiso kunye nokunciphisa ukuphazamiseka kwe-electromagnetic (EMI). Oku kuphuculweyo kukusebenza kombane kunokuguqulela kumboniso ozinzileyo nothembekileyo wokusebenza, ngakumbi kwiimeko ezibangwayo ze-electromagnetic.
Olunye uphawu olunyanzelisayo lwe-COB LCDs lulele ekomeleleni kunye nokomelela kwabo kukothuka koomatshini kunye nokungcangcazela. I-attachment ethe ngqo ye-chip kwi-substrate yeglasi, kunye ne-encapsulation ekhuselayo, inika indibano yesandi esakhiweyo ngakumbi xa kuthelekiswa nobuchule obuxhomekeke kuqhagamshelwano oluthengiswayo kwi-PCB eyahlukileyo. Obu burhabaxa bendalo benza ukuba i-COB LCDs ibe yinto ekhethwayo kwizicelo eziphantsi kweemeko zokusebenza ezirhabaxa, ezifana neepaneli zolawulo lwamashishini kunye nemiqondiso yangaphandle. Ngaphezu koko, iimpawu zolawulo lwe-thermal ye-COB zinokuba luncedo kwiimeko ezithile. Uqhagamshelwano oluthe ngqo phakathi kwe-chip kunye ne-glass substrate lunokwenza lula ukutshatyalaliswa kobushushu, nangona oku kuxhomekeke kakhulu kuyilo oluthile kunye nezinto eziqeshwe.
Nangona kunjalo, njengayo nayiphi na indlela yetekhnoloji, iiLCD zeCOB zikwabonisa iingqwalasela ezithile. Uncamathiselo lwetshiphu oluthe ngqo lufuna izixhobo ezikhethekileyo zokuvelisa kunye nobuchule, okunokukhokelela kwiindleko eziphezulu zokuseta xa kuthelekiswa nezinye iindlela zokuhlanganisa. Ngaphaya koko, ukusebenza ngokutsha okanye ukutshintshwa kwetshiphu yomqhubi engalunganga kwimodyuli ye-COB kunokuba nzima kwaye kaninzi kungenzeki. Oku kunqongophala kokulungiswa kwakhona kunokuba ngumba kwizicelo ezineemfuno zogcino olungqongqo. Ukongeza, ukuguquguquka koyilo lweemodyuli zeCOB kunokunyanzeliswa ngandlel' ithile xa kuthelekiswa neendlela ezisebenzisa ii-PCB ezahlukeneyo, apho uhlengahlengiso kunye notshintsho lwamacandelo lunokuphunyezwa ngokulula.
Ukufumana ukuqonda okubanzi ngakumbi komhlaba obanzi wendibano yemodyuli yeLCD, kufanelekile ukuqwalasela itekhnoloji ehambelanayo,kakhulu iChip-on-Glass (COG). Umbuzo othi "Uthini umahluko phakathi kweCOB kunye neCOG?" ivela rhoqo kwiingxoxo malunga nokwenziwa kwemodyuli yokubonisa. Ngelixa zombini i-COB kunye ne-COG zibandakanya uncamathiselo oluthe ngqo lwe-ICs zomqhubi kwi-substrate yeglasi, indlela yokusebenza esetyenziswayo yahluka kakhulu. Kwi-teknoloji ye-COG, umqhubi we-IC ubophelelwe ngokuthe ngqo kwiglasi usebenzisa ifilimu ye-anisotropic conductive (ACF). Le ACF iqulethe amasuntswana aqhubayo aseka uqhagamshelo lombane phakathi kweepads kwi-chip kunye neepads ezihambelanayo kwiglasi, ngelixa unikezela ukufakwa kombane kwinqwelo-moya ethe tye. Ngokungafaniyo ne-COB, i-COG ayisebenzisi i-wire bonding.
Imilinganiselo yalo mahluko usisiseko kwitekhnoloji yokudibanisa ikhonkco inkulu. Iimodyuli ze-COG ngokuqhelekileyo zibonisa iphrofayili encinci kunye nobunzima obulula xa kuthelekiswa nabalingane babo be-COB, njengoko ukupheliswa kweebhondi zocingo kuvumela ukuyila ngakumbi. Ngaphaya koko, i-COG ngokubanzi ibonelela ngoqhagamshelo lwepitch ephucukileyo, ivumela izisombululo eziphezulu zokubonisa kunye noxinzelelo olukhulu lwepixel. Oku kwenza i-COG ibe yinto ekhethiweyo yokubonisa ukusebenza okuphezulu kwii-smartphones, iipilisi, kunye nezinye izixhobo zombane eziphathwayo apho ukudibanisa kunye nokubonwayo kubaluleke kakhulu.
Nangona kunjalo, itekhnoloji yeCOG nayo ineseti yayo yorhwebo. Inkqubo yokudibanisa i-ACF inokukhathazeka ngakumbi kwiinguqu zeqondo lokushisa kunye nokufuma xa kuthelekiswa ne-encapsulation esetyenziswe kwi-COB. Ukongezelela, ukuqina koomatshini beemodyuli ze-COG kunokuba ngaphantsi kancinane kuneemodyuli ze-COB kwiindawo ezithile ezothusayo. Iindleko zokudityaniswa kwe-COG nazo zinokuba phezulu kune-COB, ngakumbi kwiisayizi ezinkulu zokubonisa kunye nezibalo eziphezulu zepini.
Ngaphaya kweCOB kunye neCOG, enye itekhnoloji ehambelana nayo ifanele ukukhankanywa yiChip-on-Flex (COF). Kwi-COF, umqhubi we-IC udityaniswe kwisekethe eprintiweyo eguquguqukayo (FPC) ethi idityaniswe kwi-substrate yeglasi. I-COF inikezela ngolungelelwaniso phakathi kokubumbana kwe-COG kunye nokuguquguquka koyilo lwezisombululo ze-PCB zemveli. Ihlala isetyenziswa kwizicelo ezifuna uyilo lokubonisa olubhetyebhetye okanye apho imiqobo yendawo ifuna unxibelelwano olubhityileyo nolugobekayo.
KwiTekhnoloji yeMalio, ukuzibophelela kwethu ekuboneleleni ngezisombululo ezahlukeneyo zokubonisa ezikumgangatho ophezulu kuyabonakala kwipotifoliyo yethu yemveliso. Ngokomzekelo, yethu "I-COB / COG / COF Module, i-FE-based Amorphous C-Cores"ungumzekelo wobuchule bethu bokwenza iimodyuli zisebenzisa iitekhnoloji ezahlukeneyo zokuhlangabezana neemfuno zesicelo. Ngokufanayo, "Imodyuli yeCOB/COG/COF, i-FE-based 1K101 Amorphous Ribbon"Ukwagxininisa ngakumbi ukuguquguquka kwethu ekusebenziseni obu buchule bokuhlanganisana obuphambili. Ngapha koko, amandla ethu anwenwela kwimiboniso yecandelo le-LCD kunye ne-LCM, njengoko kugxininiswe yindima yethu njenge "Itheminali yeCage yokulinganisa iLCD/LCM elungiselelwe iCandelo lokuBonisa ukulinganisa."Le mizekelo ibonisa ubuchule bethu bokulungelelanisa izisombululo zokubonisa iimfuno ezizodwa zamashishini ahlukeneyo.
Ukuqukumbela, itekhnoloji ye-LCD ye-Chip-on-Board (COB) imele indlela ebalulekileyo yokubonisa ukwenziwa kwemodyuli, inika iingenelo malunga nokuqina, ukomelela, kunye nokusebenza kombane okunokubakho. Ngelixa inikezela ngezithintelo ezithile malunga nokulungiswa kwakhona kunye nokuguquguquka koyilo xa kuthelekiswa nezinye iindlela ezifana ne-COG kunye ne-COF, amandla ayo endalo ayenza ibe lukhetho olunyanzelisayo kuluhlu olubanzi lwezicelo, ngakumbi ezo zifuna ukuqina kunye nokusebenza kakuhle kwendawo. Ukuqonda iinuances zetekhnoloji ye-COB, kunye nokwahluka kwayo kubuchule obunxulumeneyo, kubalulekile kwiinjineli kunye nabaqulunqi abafuna ukukhetha esona sisombululo sisiso kwiimfuno zabo ezithile. Kwi-Malio Technology, sihlala sihamba phambili ekuboniseni izinto ezintsha, sinikezela amaqabane ethu ngolwazi kunye neemveliso eziyimfuneko ukukhanyisa ikamva leteknoloji ebonakalayo.
Ixesha lokuposa: May-15-2025