Mune iyo inogara ichishanduka tekinoroji yekuratidzira tekinoroji, liquid crystal displays (LCDs) inomira sevarindi vanowanikwa kwese, ichivhenekera zvese kubva kumidziyo yedu inobatwa nemaoko kusvika kune yakanakisa dhijitari signage. Mukati meiyi nyika yakasiyana-siyana, imwe nzira yekugadzira, inozivikanwa seChip-on-Board (COB), inobata chinzvimbo chakakosha, kunyangwe ichiwanzo kuderedzwa, kukosha. PaMalio Technology, tinoramba tichiedza kujekesa kuomarara kwehunyanzvi hwekuratidzira, tichipa vatengi vedu simba nekunzwisisa kwakadzama kwezvikamu zvinotsigira hunyanzvi hwavo. Ichi chiratidziro chinotarisa mukati memitezo yeCOB LCDs, ichiongorora mavakirwo avo, zvakanakira, uye mutsauko kubva kune inoenderana matekinoroji.
Pachinhu chayo chakakosha, COB LCD inoratidzwa nekunamirwa kwakananga kweimwe kana anopfuura akabatanidzwa edunhu (IC) machipi - kazhinji mutyairi wekuratidzira - pagirazi substrate yeLCD panel. Uku kusungirirwa kwakananga kunowanikwa kuburikidza nemaitiro anozivikanwa sewaya bonding, umo minuscule goridhe kana aluminiyamu waya dzinobatanidza zvine hungwaru mapadhi ari pasilicon anofa kune anowirirana conductive pads pagirazi. Mushure mezvo, inodzivirira encapsulant, kazhinji epoxy resin, inoiswa kuchengetedza yakapfava chip uye waya zvisungo kubva kune zvakatipoteredza zvinonetsa senge mwando nekukanganisa kwemuviri. Uku kubatanidzwa kwemutyairi wedunhu akananga pagirazi kunounza imwe compact uye yakasimba yekuratidzira module kana ichienzaniswa nedzimwe nzira dzegungano.
Zvinorehwa neiyi paradigm yezvivakwa zvakawanda. Imwe yemabhenefiti akanyanya eCOB tekinoroji ndeyekuita kwayo kwenzvimbo. Nekubvisa kudiwa kweiyo yakasarudzika yakadhindwa yedunhu bhodhi (PCB) yekuisa mutyairi ICs, COB modules inoratidza yakaderedzwa zvakanyanya tsoka. Kubatana uku kunonyanya kubatsira mumashandisirwo ane nzvimbo inodhura, senge tekinoroji inopfekwa, zviridzwa zvinobatwa nemaoko, uye mamwe madhizaini emotokari. Uyezve, nzira dzakapfupikiswa dzemagetsi pakati pemutyairi chip neLCD pani dzinobatsira mukusimudzira chiratidzo chekutendeseka uye kuderedza kukanganiswa kwemagetsi (EMI). Uku kuita kwemagetsi kwakagadziridzwa kunogona kududzira kune yakagadzikana uye yakavimbika yekuratidzira mashandiro, kunyanya munzvimbo dzinoda magetsi emagetsi.
Chimwe chinomanikidzira hunhu hweCOB LCDs huri mukusimba kwavo uye kusimba kune mechaniki kuvhunduka uye kudedera. Iyo yakananga kubatanidzwa kweiyo chip kune girazi substrate, yakasanganiswa neinodzivirira encapsulation, inopa yakawedzera kurongeka gungano kana ichienzaniswa nehunyanzvi hunotsamira pane yakatengeswa kubatana kune yakaparadzana PCB. Uku kusimba kwemukati kunoita kuti COB LCDs ive sarudzo inosarudzika kune maapplication ari pasi pemamiriro ekushanda akaomarara, senge maindasitiri ekudzora mapaneru uye zviratidzo zvekunze. Zvakare, iwo thermal management maitiro eCOB anogona kubatsira mune mamwe mamiriro. Kubatana kwakananga pakati pe chip uye girazi substrate kunogona kufambisa kupisa kupisa, kunyangwe izvi zvichinyanya kutsamira pane chaiyo dhizaini uye zvinhu zvinoshandiswa.
Nekudaro, senge chero nzira yetekinoroji, COB LCDs inopawo mamwe mafungidziro. Iyo yakananga chip inonamatira inoda nyanzvi yekugadzira michina uye hunyanzvi, zvichizotungamira kumitengo yepamusoro yekuseta zvichienzaniswa nedzimwe nzira dzegungano. Uyezve, kugadzirisa kana kutsiva chip chinokanganisa mutyairi muCOB module inogona kuve yakaoma uye kazhinji isingaite basa. Uku kushaikwa kwekugadzirisa kunogona kuve chinhu mumashandisirwo ane zvakaomesesa zvekugadzirisa zvinodiwa. Pamusoro pezvo, kuchinjika kwedhizaini yeCOB modules inogona kumanikidzika kana ichienzaniswa nemaitiro anoshandisa maPCB akasiyana, uko kugadziridzwa uye shanduko yechikamu inogona kuitwa zviri nyore.
Kuti uwane kunzwisisa kwakadzama kwenzvimbo yakafara yeLCD module musangano, zvine chekuita nekufunga tekinoroji ine hukama,kunyanya Chip-on-Glass (COG). Mubvunzo "Ndeupi musiyano pakati peCOB neCOG?" kazhinji inomuka munhaurirano dzine chekuita nekugadzira module. Kunyange zvese COB neCOG zvichisanganisira kusungirirwa kwakananga kwemutyairi ICs kune girazi substrate, nzira inoshandiswa inosiyana zvakanyanya. MuCOG tekinoroji, mutyairi IC anosungirirwa zvakananga kugirazi achishandisa anisotropic conductive film (ACF). Iyi ACF ine conductive particles inomisikidza kubatanidza kwemagetsi pakati pemapadhi pa chip nemapadhi anowirirana pagirazi, apo ichipa magetsi ekudzivirira mundege yakachinjika. Kusiyana neCOB, COG haishandise waya yekubatanidza.
Mhedzisiro yemusiyano wakakosha uyu mune tekinoroji yekubatanidza yakakura. COG modules anowanzo ratidza chimiro chidiki uye huremu huremu kana zvichienzaniswa nevamwe vavo veCOB, sezvo kubviswa kwewaya mabhondi kunobvumira dhizaini yakagadziridzwa. Uyezve, COG inowanzopa hukama hwakanaka, hunoita kuti zvigadziriswe zvepamusoro uye mapixel densities makuru. Izvi zvinoita kuti COG ive sarudzo inosarudzika yezviratidziro zvemhando yepamusoro muma smartphones, mahwendefa, uye zvimwe zvinotakurika zvemagetsi uko compactness uye kuona acuity kwakakosha.
Nekudaro, tekinoroji yeCOG zvakare ine yayo seti yekutengeserana-offs. Iyo ACF bonding process inogona kutarisisa kune tembiricha uye humidity kusiyana kana ichienzaniswa neiyo encapsulation inoshandiswa muCOB. Pamusoro pezvo, iyo mechanic kusimba kweCOG modules inogona kunge yakaderera zvishoma pane iyo COB modules mune dzimwe nzvimbo dzinotyisa zvakanyanya. Mutengo weCOG musangano unogona zvakare kukwira kupfuura COB, kunyanya kune akakura ekuratidzira saizi uye yakakwirira pini kuverenga.
Kupfuura COB neCOG, imwe tekinoroji yakabatana inofanirwa kutaurwa ndeye Chip-on-Flex (COF). MuCOF, mutyairi IC anosungirirwa kune inochinjika yakadhindwa yedunhu (FPC) iyo inobva yabatanidzwa kune girazi substrate. COF inopa chiyero pakati pekubatana kweCOG uye dhizaini inoshanduka yeyakajairwa PCB-yakaiswa mhinduro. Inowanzo shandiswa muzvishandiso zvinoda madhizaini anochinjika kana uko zvimhingamipinyi zvenzvimbo zvinoda kubatana kwakatetepa uye kunopindika.
PaMalio Technology, kuzvipira kwedu kupa akasiyana uye emhando yepamusoro zvigadziriso zvinoonekwa mune yedu yakazara chigadzirwa portfolio. Semuenzaniso, yedu "COB/COG/COF Module, FE-based Amorphous C-Cores"inoenzanisira hunyanzvi hwedu mukugadzira mamodule tichishandisa akasiyana chip-on tekinoroji kusangana nezvinodiwa zvekushandisa. Saizvozvo, "COB/COG/COF Module, FE-based 1K101 Amorphous Ribbon"Inosimbisazve kuenderana kwedu mukushandisa idzi nzira dzepamusoro dzegungano. Uyezve, kugona kwedu kunotambanudzira kune yakagadziridzwa LCD neLCM segment zviratidziro, sezvinoratidzwa nebasa redu se "Cage Terminal yeMeter Yakagadzirirwa LCD/LCM Segment Display yeMetering."Mienzaniso iyi inoratidza hunyanzvi hwedu mukugadzirisa zvigadziriso zvekuratidzira kune zvakasarudzika zvinodiwa zvemaindasitiri akasiyana.
Mukupedzisa, Chip-on-Board (COB) LCD tekinoroji inomiririra nzira yakakosha yekuratidzira magadzirirwo emodule, ichipa mabhenefiti maererano nekubatana, kusimba, uye inogona kukwidziridzwa kushanda kwemagetsi. Kunyange ichipa zvimwe zvipimo maererano nekugadzirisa uye dhizaini inoshanduka kana ichienzaniswa nedzimwe nzira dzakaita seCOG neCOF, masimba ayo echisikigo anoita kuti ive sarudzo inogombedzera kune yakafararira maapplication, kunyanya ayo anoda kusimba uye kugona kwenzvimbo. Kunzwisisa iwo nuances yeCOB tekinoroji, pamwe nemisiyano yayo kubva kune inoenderana matekiniki, kwakakosha kune mainjiniya nevagadziri vari kutsvaga kusarudza yakakwana yekuratidzira mhinduro yezvavanoda chaizvo. PaMalio Technology, isu tinoramba tiri pamberi pekuratidzira hunyanzvi, tichipa vatinoshanda navo ruzivo uye zvigadzirwa zvinodiwa kuvhenekera ramangwana rekuona tekinoroji.
Nguva yekutumira: May-15-2025